Integrated Photonic Systems Engineering

Realizing practical photonic and quantum technologies requires moving beyond individual devices toward tightly integrated, scalable systems that combine diverse optical, electronic, and quantum functionalities. Our research develops heterogeneous photonic architectures that integrate III–V lasers, nonlinear components, ultralow-loss SiN circuits, high-efficiency photodetectors, and electronic control within common chip-scale platforms. We extend this systems approach to integrated quantum sensors, including magneto-optic photonic magnetometers, and electrically controlled quantum light sources based on quantum dots integrated with microcavities and photonic circuitry. A growing emphasis is on photonic packaging and chip-to-chip integration, leveraging new capabilities at OASIS for photonic wirebonding to connect disparate material platforms, devices, fibers, and electronic interfaces into complete systems. Together, these efforts bridge materials, devices, fabrication, packaging, and system-level engineering to enable compact and manufacturable photonic technologies for quantum information processing, sensing, communications, and precision measurement.

Current projects in the QPL include:

• III-V-on-SiN heterogeneous integration including lasers, nonlinear materials, entanglement sources, and high-QE photodetectors integrated with ULL SiN circuits [with Nexus Photonics, UVA, MIT LIGO]
• Room temperature magnetometers based on photonically integrated magneto-optic materials [with NNSS STL and University of Cagliari]
• Electrically tunable and cavity integrated deterministic single photon sources and integrated electronics and mode-locked lasers into a turnkey packaged system [with UCSB startup Qudara]